Process Technology
AnalogicTech combines advanced power management circuit design with proprietary process technology. While CMOS is the most widely used process technology, especially for purely digital ICs, a high voltage biCMOS-DMOS (BCD) type of process is required for multi-voltage and high-voltage applications, and for higher power applications where discrete power transistors are used.

AnalogicTech has developed two proprietary process technologies which enable us to provide single chip or multi chip solutions resulting in reliable, cost effective, power efficient, and space efficient designs.

---

ModularBCD
Compared to linear-IC legacy fabs and generic digital CMOS foundries, AnalogicTech's ModularBCD provides more cost-effective fabrication of analog, power and mixed-signal ICs by monolithically integrating fully-isolated CMOS at multiple voltages, complementary bipolar transistors and robust power devices. This process leverages the advanced capabilities of cost-depreciated former DRAM fabs and avoids complex techniques such as epitaxy and high-temperature diffusion.

Modular BCD process benefits include:

higher levels of integration smaller circuit size higher yield

better power efficiency optimized wafer cost minimized masking

In addition, this process is completely modular meaning AnalogicTech can quickly assemble circuit blocks into customized ICs reducing customer time-to-market.

---

TrenchDMOS
AnalogicTech has also developed a proprietary TrenchDMOS process for fabricating discrete power transistors that exhibit a "power loss per silicon area" that is far superior to integrated power transistors. This process enables N-channel and P-channel devices with voltage ratings up to 60V and on-resistance as low as 0.005 ohms. TrenchDMOS devices can be co-packaged with an AnalogicTech control chip to provide a lower-cost, higher-performance solution to our customers. And, new device layouts can be quickly created and optimized for a given application.

 

 

 

---

Packaging Technology
As consumer electronic devices support more applications, features and services with limited space and limited battery capacity, it is becoming increasingly important to offer smaller, higher-efficiency power management semiconductors assembled in area-efficient packages that require fewer external components to implement.

CSP-5 chip scale package and SC70-JW package

Working with packaging partners, AnalogicTech develops new packages that optimize device performance, save space, and offer ease-of-use and low cost. As package size continues to shrink, AnalogicTech offers significant new developments. For example, the SC70JW package:

• Measures only 2.1mm long by 2mm wide (4.2mm2 footprint)
• Offers significant functionality in the smallest possible package
• Contains a die-to-footprint ratio five times greater than the standard SC70
• Provides excellent thermal resistance
• Utilizes standard surface mount technology

AnalogicTech also develops area-efficient multi-chip packages to meet more complex power management needs in a smaller footprint.

Combining analog CMOS and ModularBCD power management ICs with one or more discrete vertical TrenchDMOS devices, AnalogicTech is able to increase the maximum current capability of packaged parts beyond the limits of a purely monolithic approach.